Thin Film Patterning Device "FILM LASER"
Integration of processing into a unified device! A laser system that improves production efficiency through automatic cutting.
The thin film patterning device "FILM LASER" is specialized for thin film removal processing on various substrates such as glass and resin. Upon request, the maximum processing area size can be up to 800mm x 800mm, and it can accommodate fine patterns with a line and space of 20μm/20μm. It also supports roll-to-roll device integration. 【Features】 ■ Processing range: 800mm x 800mm (customizable) ■ Line & space: 20μm/20μm ■ Mass production speed: 5,000mm/s ■ Integration of roll-to-roll, loader, and unloader processing ■ Improved production efficiency through automatic cutting For more details, please refer to the catalog or feel free to contact us.
- Company：デルファイレーザージャパン
- Price：Other
